Charge Transport Across Metal N-Type Semiconductor Interfaces.

dc.contributor.advisorElfagd, Yitagesu (PhD)
dc.contributor.authorTamrat, Feredelign
dc.date.accessioned2019-10-18T13:07:19Z
dc.date.accessioned2023-11-09T11:26:14Z
dc.date.available2019-10-18T13:07:19Z
dc.date.available2023-11-09T11:26:14Z
dc.date.issued2018-11-05
dc.description.abstractIn this study, we considered the thermionic emission, field emission and tunneling and we derived current density as a functions of different parameters such as, temperature, barrier height, work function, bias voltage and dopant concentration for thermionic emission, field emission and tunneling enhanced electron transport across metal and N-type semiconductor interfaces. The result shows that the thermionic current density is increasing exponentially as a functions of bias voltage, the current density is also increasing as a quadratic functions of temperature and current density is increasing linearly as a functions of dopant concentration. Therefore, we carry out investigation how these factors affect the current density and we solve the current density analytically with a given parameters. The results are plotted using gnuplot.en_US
dc.identifier.urihttp://10.90.10.223:4000/handle/123456789/19507
dc.language.isoenen_US
dc.publisherAddis Ababa Universityen_US
dc.subjectCharge Transporten_US
dc.subjectAcross Metal N-Typeen_US
dc.subjectSemiconductor Interfacesen_US
dc.titleCharge Transport Across Metal N-Type Semiconductor Interfaces.en_US
dc.typeThesisen_US

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